Like Ten Technology
Precision Metal Etching
Established 2006 • Shenzhen
Shenzhen Like Ten Technology Co., Ltd. fuses photochemical etching with precision forming, post-etch stamping, and laminated die cutting so RF shields, bipolar plates, and thermal hardware move from prototype to mass production without tooling risks.
72h
Prototype Kickoff
200+
Programs Delivered
ISO 9001 / IATF 16949
Quality System
Ideal for EMI/RFI shields, fuel-cell plates, precision meshes, sensors, and microfluidic components.
Reference builds showcase how Like Ten integrates etching, forming, stamping, and inspection for demanding platforms.
We orchestrate every stage—from artwork design and chemistry control to forming, stamping, lamination, and delivery—so you only manage one supplier.
±0.02 mm accuracy across stainless, copper alloys, titanium, aluminum, Invar, and Kovar.
Coining, jog-bending, shallow draws, and coined standoffs to turn flat etch blanks into functional 3D components.
Hybrid workflows etch fine geometries first, then apply progressive stamping for beads, coined pads, and fastener interfaces.
Apply engineered films to stainless or copper stock, die cut openings, and etch patterns for advanced shielding stacks.
DFM, tolerance stack-up analysis, digital documentation, and logistics support for global OEM ramp schedules.
Hybrid Manufacturing
Etch delicate webs, then transfer to stamping dies that form beads, louvers, or tabs without collapsing thin sections.
Laminated Lines
Adhere PI/PET films onto stainless, die cut, and etch to create isolation layers for advanced EMI shields.
Luxury Finish
Edge control ±0.02 mm, burr-free surfaces, and brushed finishes curated for premium automotive interiors.
Our alloy library covers high-strength steels, exotic metals, and conductive copper families treated with tuned chemistry profiles.
Metrics derived from production programs in aerospace, energy, and semiconductor platforms.
From cabin electronics to hydrogen platforms, we design for performance-critical environments.
Low-distortion avionics shields, cooling plates, precision meshes, and lightweight brackets with AS9100-ready documentation.
Connector springs, optical encoder discs, photonics carriers, and RF gaskets that maintain flatness under reflow.
Bipolar plates, battery current collectors, and hydrogen stack components engineered for corrosive media.
Reference geometries ranging from fine-pitch meshes to dual-depth bipolar plates showcase our surface quality and feature fidelity.
CASE SNAPSHOT
For a European fuel-cell integrator, we delivered 20,000 bipolar plates annually with dual-depth etched cooling channels, precision forming for seal beads, and dimensional validation. The hybrid etch-forming approach lowered pressure drop by 12% and eliminated tooling scrap versus stamped alternatives.
12%
Flow Improvement
0
Tooling Scrap Events
8 Weeks
Prototype-to-Ramp
Share drawings, performance targets, and annual volumes. We will respond within one business day with DFM guidance and a detailed quotation.
Prefer email?
Submit RequestOur engineering inbox routes directly to program managers for aerospace, energy, and electronics customers.