Photochemical Etching
We fabricate complex geometries without inducing stress, burrs, or heat zones. Our phototool workflow mirrors the discipline seen at leading etching houses, giving OEM teams rapid design freedom.
- Resolution: 20 μm features, 10 μm positional accuracy
- Thickness window: 0.02–2.0 mm for stainless steel, copper, aluminum, titanium, Invar, Kovar, and nitinol
- Panel sizes up to 600 x 800 mm; reel-to-reel support for continuous strips
- Double-sided etching with optical alignment for manifolds and bipolar plates
| Material | Typical Tolerance | Notes |
|---|---|---|
| Stainless Steel 301/304/316 | ±0.02 mm | Ideal for EMI lids, encoder discs, filters |
| Titanium & Nitinol | ±0.03 mm | Controlled oxide management for aerospace-grade assemblies |
| Copper & Phosphor Bronze | ±0.02 mm | Connector springs, sensor frames |
| Invar / Kovar | ±0.025 mm | Optical, photonics, hermetic frames |
Precision Forming & Mechanical Integration
Soft tooling, modular forms, and progressive bending transform flat parts into functional assemblies with controlled height and geometry.
- Coining and jog-bending for shielding lids and thermal plates
- Feature forming for standoffs, dimples, or flow channels
- Automated dimensional checks using vision systems
- Mechanical assembly of multi-layer laminations or spacer stacks
Forming Envelope
- Draw depth up to 4 mm (material dependent)
- Coined step height repeatability within ±0.03 mm
- Parallelism validated across 100% of critical parts
- Optional adhesive or diffusion bonding pre-stages
Post-Etch Stamping
Delicate webs are etched first, then transferred to stamping dies that add beads, louvers, dimples, or fastening tabs without collapsing thin sections.
- Progressive or single-hit dies aligned to etched datums
- Coined contact pads, jog bends, and shallow draws
- Inline flatness and thickness checkpoints
Stamping Envelope
Typical die strokes up to 4 mm with step repeatability of ±0.03 mm. Custom nests ensure positional accuracy part-to-part.
Film Lamination & Die Cutting
We laminate PI/PET or adhesive films onto stainless or copper strip, die cut openings, and proceed with etching to deliver multi-layer shielding and gasket stacks.
- Roll-to-roll lamination with tension control
- Steel-rule or hard-tooled die cutting before and after etch
- Alignment features to register films with etched artwork
Applications
Composite RF shields, thermal interface shims, battery insulators, and any assembly needing insulating films bonded to etched metal.
Engineering Support & Fulfillment
- DFM feedback in 48 hours with tolerance stack-up recommendations
- Material procurement, safety stock, and VMI strategies
- Digital traveler, inspection reports, and capability summaries
Engagement Models
Prototype-only, bridge builds, or full-rate production. Dedicated program managers coordinate change control and logistics.
Plan Your Next Build
Share CAD data, tolerances, annual usage, and inspection requirements. Our engineers will recommend etching parameters, forming limits, stamping envelopes, and die-cut strategies tailored to your industry.
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